Influence of strain rate and Sn in solid solution on the grain refinement and crystalline defect density in severely deformed Cu

A commercially pure Cu and a Cu-8 wt.%Sn alloy were subjected to high pressure torsion (HPT) study the effect of Sn as solute element deformation rate on grain refinement mechanism defect accumulation in Cu. The microstructure hardness produced ultrafine grained (UFG) states both materials carefully characterized. We show that addition leads significant decrease size, higher stored energy increase accompanied with delay saturation shear strain. Increasing HPT induces heat dissipation processed markedly pronounced CuSn8 compared Surprisingly, has opposite microhardness UFG CuSn8, which decreases for case Cu, while exhibits faster values CuSn8. also despite self-heating at rates, rotation speed provides reduction size density alloy. This is assumed be related strong interactions between atoms strain-induced defects so mechanically driven effects prevail over dynamic annihilation dislocations. Finally, we present qualitative model based phenomena production was able reproduce evolution concentrations different parameters after material.